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multi-chip packaging S78HL512TC0BHB003 Infineon Technologies -
2500
多芯片封装 Nor 109.0644
multi-chip packaging S76HS512TC0BHB013 Infineon Technologies -
2500
多芯片封装 Nor 113.9591
multi-chip packaging 04EM04-N3GM627-GA06U Kingston -
642
多芯片封装 4GB+4Gb221 ball FBGA 50.9181
multi-chip packaging S76HL512TC0BHB000 Infineon Technologies -
646
多芯片封装 Nor 109.0644
multi-chip packaging 32EP16-M4FTC32-GA68 Kingston -
526
多芯片封装 32GB+16Gb144 ball ePoP 148.0169
multi-chip packaging MT29C4G48MAZBBAKB-48 IT TR Micron -
768
多芯片封装 MASSFLASH/MOBILE DDR 6G 83.2638
multi-chip packaging 32EM16-M4CTX29-8AD11 Kingston -
640
多芯片封装 32GB+16Gb 254 ball FBGA 110.4884
multi-chip packaging MT29GZ5A5BPGGA-53AAT.87J Micron -
886
多芯片封装 MASSFLASH/LPDDR4 8G 97.3365
multi-chip packaging MT29C4G48MAYBBAKS-48 IT Micron -
1323
多芯片封装 MASSFLASH/MOBILE DDR 6G 83.2638
multi-chip packaging MT29GZ5A5BPGGA-046IT.87J Micron -
1760
多芯片封装 NAND MCP 8G VFBGA 75.857
multi-chip packaging S71KS512SC0BHB000 Infineon Technologies -
1211
多芯片封装 Nor 125.1234
multi-chip packaging S71KL512SC0BHV000 Infineon Technologies -
517
多芯片封装 Nor 106.6718
multi-chip packaging S71KL256SC0BHB003 Infineon Technologies -
500
多芯片封装 Nor 70.8541
multi-chip packaging S71KL512SC0BHB003 Infineon Technologies -
500
多芯片封装 Nor 77.915
multi-chip packaging W25M512JVFIQ S Winbond -
500
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector 28.48
multi-chip packaging W25M512JVFIQ TR Winbond -
500
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector 26.9378
multi-chip packaging W25M512JVEIM TR Winbond -
500
多芯片封装 spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR 23.6935
multi-chip packaging W25M512JVEIM Winbond -
500
多芯片封装 spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR 37.1322
multi-chip packaging W25M512JVBIQ TR Winbond -
500
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector 27.1642
multi-chip packaging MT29GZ6A6BPIET-046IT.112 Micron -
500
多芯片封装 NAND MCP 16Gb 81.7807
multi-chip packaging MT29GZ6A6BPIET-53IT.112 Micron -
500
多芯片封装 MASSFLASH/LPDDR4 16G 81.7807
multi-chip packaging MT29GZ5A5BPGGA-53AIT.87J Micron -
500
多芯片封装 MASSFLASH/LPDDR4 8G 61.9642
multi-chip packaging W71NW11GF1EW Winbond -
500
多芯片封装 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16 35.195
multi-chip packaging W25M512JWBIM TR Winbond -
500
多芯片封装 spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR 27.2246
multi-chip packaging W25M512JWCIQ TR Winbond -
500
多芯片封装 spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR 27.2246
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