S78HL512TC0BHB003 | Infineon Technologies | - |
2500
|
多芯片封装 Nor | 109.0644 | |||
S76HS512TC0BHB013 | Infineon Technologies | - |
2500
|
多芯片封装 Nor | 113.9591 | |||
04EM04-N3GM627-GA06U | Kingston | - |
642
|
多芯片封装 4GB+4Gb221 ball FBGA | 50.9181 | |||
S76HL512TC0BHB000 | Infineon Technologies | - |
646
|
多芯片封装 Nor | 109.0644 | |||
32EP16-M4FTC32-GA68 | Kingston | - |
526
|
多芯片封装 32GB+16Gb144 ball ePoP | 148.0169 | |||
MT29C4G48MAZBBAKB-48 IT TR | Micron | - |
768
|
多芯片封装 MASSFLASH/MOBILE DDR 6G | 83.2638 | |||
32EM16-M4CTX29-8AD11 | Kingston | - |
640
|
多芯片封装 32GB+16Gb 254 ball FBGA | 110.4884 | |||
MT29GZ5A5BPGGA-53AAT.87J | Micron | - |
886
|
多芯片封装 MASSFLASH/LPDDR4 8G | 97.3365 | |||
MT29C4G48MAYBBAKS-48 IT | Micron | - |
1323
|
多芯片封装 MASSFLASH/MOBILE DDR 6G | 83.2638 | |||
MT29GZ5A5BPGGA-046IT.87J | Micron | - |
1760
|
多芯片封装 NAND MCP 8G VFBGA | 75.857 | |||
S71KS512SC0BHB000 | Infineon Technologies | - |
1211
|
多芯片封装 Nor | 125.1234 | |||
S71KL512SC0BHV000 | Infineon Technologies | - |
517
|
多芯片封装 Nor | 106.6718 | |||
S71KL256SC0BHB003 | Infineon Technologies | - |
500
|
多芯片封装 Nor | 70.8541 | |||
S71KL512SC0BHB003 | Infineon Technologies | - |
500
|
多芯片封装 Nor | 77.915 | |||
W25M512JVFIQ S | Winbond | - |
500
|
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector | 28.48 | |||
W25M512JVFIQ TR | Winbond | - |
500
|
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector | 26.9378 | |||
W25M512JVEIM TR | Winbond | - |
500
|
多芯片封装 spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR | 23.6935 | |||
W25M512JVEIM | Winbond | - |
500
|
多芯片封装 spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR | 37.1322 | |||
W25M512JVBIQ TR | Winbond | - |
500
|
多芯片封装 spiFlash, 512M-bit, 4Kb Uniform Sector | 27.1642 | |||
MT29GZ6A6BPIET-046IT.112 | Micron | - |
500
|
多芯片封装 NAND MCP 16Gb | 81.7807 | |||
MT29GZ6A6BPIET-53IT.112 | Micron | - |
500
|
多芯片封装 MASSFLASH/LPDDR4 16G | 81.7807 | |||
MT29GZ5A5BPGGA-53AIT.87J | Micron | - |
500
|
多芯片封装 MASSFLASH/LPDDR4 8G | 61.9642 | |||
W71NW11GF1EW | Winbond | - |
500
|
多芯片封装 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16 | 35.195 | |||
W25M512JWBIM TR | Winbond | - |
500
|
多芯片封装 spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR | 27.2246 | |||
W25M512JWCIQ TR | Winbond | - |
500
|
多芯片封装 spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR | 27.2246 |